Molded Interconnect System (MIS) – Pre-molded, routable, fine pitch leadframe solution for complex designs that require a smaller package footprint and thinner package height.
Unisem provides complete turnkey assembly services of leadless, laminate, leadframe and wafer level packages through its three full turnkey factory locations in Malayasia, China and Indonesia.
Unisem provides a full range of package testing services include analog, digital and mixed signal testing with over 100 test systems and more than 150,000 total square feet dedicated to testing.
Unisem offers wafer bumping services through its subsidiary Unisem Advanced Technologies (UAT) in Ipoh, Malaysia and at their factory in Chengdu, China. Unisem offers over 100 variations of gold, copper pillar and solder bumping options.
Unisem Chengdu (China) offers wafer bumping as well as full turnkey semiconductor assembly and test services including wafer probe, wafer backgrinding, assembly, test, and drop-shipping of finished goods.