Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include assembly, test, failure analysis, and electrical and thermal characterization. Unisem supports customer on organic substrate & Copper lead frame development, which is one of the key parts on Package Development to meet customers’ product needs & performances as well as DFM (Design for Manufacturing). With approximately 7,000 employees worldwide, Unisem has factory locations in Ipoh, Malaysia and Chengdu, People’s Republic of China. The company is headquartered in Kuala Lumpur, Malaysia.