Unisem’s worldwide operations include factory facilities in Malaysia and China. Unisem offers a full turnkey solution from package development to your assembled and tested package as well as a full range of wafer bumping services. Areas of technology focus include MEMs, Modules/SIP packages, WLCSP and wafer bumping. With over 1.5 million square feet of factory floor space and more than 540,000 square feet of clean rooms, Unisem is ready to meet your high volume assembly, test and wafer bumping needs.