Our turnkey services include Package Development, Wafer Probing, Wafer Bumping/WLCSP, Assembly Packaging, Final Electrical Testing, Reliability Testing & Failure Analysis, Warehousing & Drop Shipment. And with our real-time WIP systems and drop shipping to OEM’s, Unisem offers its customers everything needed for time-to-market wins.
Unisem offers a broad range of standard and custom Leadframe and Laminate packages with pin counts ranging from 3 to 484+. Also offered are WLCSPs or Wafer-Level Chip-Scale Packages which is a low cost solution that enables direct connectivity at the substrate or board level.