Our turnkey services including Package Development, Wafer Probe, Wafer Bumping / WLCSP, Assembly Packaging, Final Electrical Test, Reliability Test, Warehousing & Drop Shipping. Our turn-key services include Electrical and Thermal Characterization, Design, Assembly, Testing, Failure Analysis and more. And with our real-time WIP systems and drop shipping to OEM’s, Unisem offers its customers everything needed for time-to-market wins.
Unisem offers a broad range of standard and custom Leadframe and Laminate packages with pin counts ranging from 3 to 484+. Also offered are WLCSPs or Wafer-Level Chip-Scale Packages which is a low cost solution that enables direct connectivity at the substrate or board level.