The small size of these packages, coupled with excellent thermal and electrical performance, make leadless leadframe packages such as the SLP and Stacked Die SLP ideal for hand held and portable communications applications including cellular phones, personal digital assistants (PDAs) and other applications where small, high performance packages are required. This package is also available in 2 and 3 Die configurations in Stacked Die, MCM and SIP (System-In-Package) versions which bring enhanced functionality, package performance and integration perfectly suited for wireless and other applications needing system integration in a single package format.