Unisem offers a Wafer Level CSP low cost solution that enables direct connectivity at the substrate or board level. To help provide this service we are equipped with latest state-of-the art Laser Mark, Laser Groove, Camtek & Rudolph Wafer 2D/3D inspection station and high speed Muhlbauer Die Sorter. We offer a full turnkey solution for Wafer Level CSP from WAFER BUMPING, PACKAGING, TEST SOLUTION (probing) and full wafer map integration to handle die size from 0.2 sq.mm to 36 sq.mm.