Unisem offers wafer bumping services through its subsidiary Unisem Advanced Technologies (UAT). UAT is a 3-party joint venture between Unisem, Advanpack Solutions and FlipChip International. Located at the same premise as Unisem Ipoh, customers receive seamless integration of a wide variety of services under one roof covering wafer bumping, wafer backgrinding, wafer probe, dicing, final test and flip-chip assembly.
UAT offers gold bumps, copper pillar bumps and solder bumps (through ball drop, plating and solder paste printing). Additionally, UAT provides repassivation and bond pad redistribution services. UAT is truly a one-stop center for all your bumping needs.